Topics of this journal include laser-based technology for the following subjects, but not limited to;
- Fundamental aspects (Dynamics, Modeling, Simulation, etc.)
- Process monitoring and control
- Nanotechnology
- Direct write process (MAPLE-DW, LIFT, etc.)
- Ultra-short pulse laser processing
- VUV laser processing
- Surface treatment (Texturing, Cleaning, Annealing, modification, etc.)
- Micro-patterning and micro-structuring
- Micro-machining
- 3-D micro- and nano-fabrication
- Drilling and cutting
- Welding and bonding
- Micro-forming
- Wafer dicing
- Marking and trimming
- Packaging and mounting process
- Lithography (including EUV Source and Application)
- Manufacture of micro devices and systems
- Film deposition and synthesis of advanced materials (PLD, CVD, etc)
- Nano- and micro-particles
- Medical and biological applications
- Optics and systems for laser microprocessing
- Laser devices
- Industrial applications
- Photochemistry
- Glass/Ceramic processing
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