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         Topics of this journal include laser-based technology for the following subjects, but not limited to; 
- Fundamental aspects (Dynamics, Modeling, Simulation, etc.)
 
- Process monitoring and control
 
- Nanotechnology
 
- Direct write process (MAPLE-DW, LIFT, etc.)
 
- Ultra-short pulse laser processing
 
- VUV laser processing
 
- Surface treatment (Texturing, Cleaning, Annealing, modification, etc.)
 
- Micro-patterning and micro-structuring
 
- Micro-machining
 
- 3-D micro- and nano-fabrication
 
- Drilling and cutting
 
- Welding and bonding
 
- Micro-forming
 
- Wafer dicing
 
- Marking and trimming
 
- Packaging and mounting process
 
- Lithography (including EUV Source and Application)
 
- Manufacture of micro devices and systems
 
- Film deposition and synthesis of advanced materials (PLD, CVD, etc)
 
- Nano- and micro-particles
 
- Medical and biological applications
 
- Optics and systems for laser microprocessing
 
- Laser devices
 
- Industrial applications
 
- Photochemistry
 
- Glass/Ceramic processing
 
 
        
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