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会議開催最新情報

LAMP2019 第8回レーザ先端材料加工国際会議

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LAMP2019 The 8th International Congress on Laser Advanced Materials Processing

第8回レーザ先端材料加工国際会議

LPM2019 - The 20th International Symposium on Laser Precision Microfabrication

第20回レーザ精密微細加工国際シンポジウム

HPL2019 - The 8th International Symposium on High Power Laser Processing

第8回高出力レーザ加工国際シンポジウム

 

Date: May 21-24, 2019

Venue:  International Conference Center Hiroshima (広島国際会議場)

Organizer: Japan Laser Processing Society (JLPS) 

Website:  http://www.jlps.gr.jp/lamp/lamp2019/

Topics: LAMP2019_Topics.pdf

 

General ChairKoji Sugioka, RIKEN, Japan

Co-Chairs:     

Hiroyuki Niino, AIST, Japan (LPM2019 Program Committee Chair)

Seiji Katayama, NADEX, Japan (HPL2019 Program Committee Chair)

Takashi Ishide, Mitsubishi Heavy Industries, Japan (JLPS President)

Yongfeng Lu, University of Nebraska-Lincoln, USA

Michael Schmidt, Friedrich- Alexander Universität Erlangen-Nürnberg, Germany       

Steering Committee Chair: Kenji Shinozaki, Hiroshima University, Japan


E-mail: lamp2019(at mark)jlps.gr.jp


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